Focus on Grinding, Polishing, CMP technology.
Committed to become the global leader in semiconductor equipment!
Responsibilities drive quality, Make equipment by heart, Support China's Chip Industry
Semiautomatic Single-axis Grinding Machine
Semiautomatic Double-axis Grinding Machine
Full Automatic Grinding Machine
Horizontal Grinding Machine
Leading innovation, boosting intelligent manufacturing, TSD takes technological innovation as the driving force for sustainable development, insists on independent innovation oriented by customer needs, and provides equipment solutions with superior performance, high production efficiency and cost-effectiveness for customers and the market, brings unlimited possibilities to the industry.
TSD can provide grinding, lapping, polishing, waxing, cleaning machines and process solutions for various semiconductor substrate materials.View details
TSD can provide grinding, lapping, polishing, waxing machines and process solutions for various semiconductor devices.View details
TSD can provide wafer grinding, CMP, post-CMP cleaning, EMC grinding, EMC flattening, EMC grooves machines and process solutions for advanced packaging process such as FlipChip, Bumping, TSV, SIP, etc..View details
TSD can provide CMP, post-CMP cleaning, grinding, polishing machines and process solutions for various MEMS wafers.View details
Beijing TSD Semiconductor Equipment Co., Ltd. takes the mission of "Technology and Services assist customers to Develop", focuses on R&D, production and sales of high-quality surface processing equipment in the semiconductor industry. With more flat, thinner and faster technology orientation, the company focuses on compound semiconductor substrate materials, semiconductor devices, advanced packaging, MEMS and other fields, provides systemic solutions and process equipment for grinding, polishing, and CMP.
Add：Building 6, No. 3, Duyang North Street, Shunyi District, Beijing 101300